Despite record earnings, SK Hynix faces mounting challenges in meeting explosive demand for its HBM memory chips:

Supply Chain Bottlenecks

  • 18-month lead times for ASML’s EUV lithography machines
  • Specialty gas shortages from Ukraine conflict
  • 94% utilization at Korean fabs (no spare capacity)

Customer Allocation Strategies

  • Nvidia receives 65% of HBM3E output
  • Microsoft/Amazon get priority for next-gen HBM4
  • Automakers like Tesla placed on 12-month waitlists

“Every wafer is spoken for through 2026,” admitted COO Lee Kang-Wook, noting the company is:

  • Running factories 24/7 with no maintenance downtime
  • Air freighting chips from Korea to bypass port delays
  • Implementing 3-shift “ghost crews” for rapid scaling

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